Company Details

  • JINAN EMI SHIELDING TECHNOLOGY CO., LTD.

  •  [Shandong,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , East Europe , Europe , Middle East
  • Exporter:61% - 70%
  • Certs:ISO14001, ISO9001, REACH, RoHS
  • Description:Thermal Conductive Pad,Thermal Pad Material,Thermal Interface Pad,Thermal Conductive Gap Pad
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JINAN EMI SHIELDING TECHNOLOGY CO., LTD.

Thermal Conductive Pad,Thermal Pad Material,Thermal Interface Pad,Thermal Conductive Gap Pad

Home > Products > Thermal Management Products > Thermal Conductive Pad

Thermal Conductive Pad

Product categories of Thermal Conductive Pad, we are specialized manufacturers from China, Thermal Conductive Pad, Thermal Pad Material suppliers/factory, wholesale high-quality products of Thermal Interface Pad R & D and manufacturing, we have the perfect after-sales service and technical support. Look forward to your cooperation!
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Thermal Conductive Gap Pad
  • Packaging: carton
  • Min. Order: 1 Piece/Pieces
  • Model No.: TGP-001
  • Place of Origin: china
  • Productivity: 1000

Silicon Thermal Conductive Gap Filler Pad Features: 3.00 W/mk thermal conductivity Low Thermal Resistance at Low Pressure Naturally tacky for easy application

China Thermal Conductive Pad of with CE
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China Thermal Conductive Pad Suppliers

Thermal Conductive Pad

Silicone Thermal Conductive Gap Filler Pad could reach 6.0 W/mk Between heat-generation Component and heatsink Automotive engine control, Graphices Cards, Telecom device Wireless Hub,Military equipment, power supply Cooling Module, Thermal module,

1. High bond strength to surfaces

2. Thermal conductivity in combination with electrical isolation

3. Excellent wet out

4. High temperature stability

Application:

1.For CPU, LED,PPR heat sink, microprocessor
2.For any power consumption semiconductor
2.Replacing screws, fasteners and other fixed means
4.Fixing heat sink on the power supply circuit board
5.Fixing heat sink on vehicle control circuit board
6.Fixing heat sink on packaged chips

we could die cut any size and shapes as customer design.


Silicone Thermal Conductive Gap Filler Pad

Thermal Conductive Pad1

Thermal Conductive Gap Filler Pad

TP-600


TEST ITEM

TEST MOTHOD

UNIT

VALUE

SIZE


mm

400*200MM

COLOR

Visual


Blue

THICKNESS

ASTM D374

mm

0.3-10MM

GRAVITY

ASTM D792

g/cc

2.85±0.1

HARDNESS

ASTM D2240

Shore 00

25±5

TENSILE STRENGTH

ASTM D412

kg/cm2

55

ELONGATION

ASTM D412

%

60 95

TEMP

EN344

-40~+220

VOLUME RESISTIVITY

ASTM D257

Ω•CM

3.1*1011

BREAKDOWN VOLTAGE

ASTM D149

kv/mm

5

VOLUME IMPENDENCE

ASTM D257

Ω.cm

1.7×1013

Weight Damnify

200 200H

%

≤1

Thermal Resistance

ASTM D5740

/ W

0.18

FLAMMABLITY

UL-94


V-0

THERMAL CONDUCTIVITY

ASTM D5470

w/(m•k)

6


TP-240


TEST ITEM

TEST MOTHOD

UNIT

VALUE

COLOR

Visual


GRAY

THICKNESS

ASTM D374

mm

0.5~10

GRAVITY

ASTM D792

g/cc

1.8-2.2

HARDNESS

ASTM D2240

Shore00

30±5

TENSILE STRENGTH

ASTM D412

kg/cm2

2.3




TEMP

EN344

-40~+220

VOLUME RESISTIVITY

ASTM D257

Ω•CM

1.7*1013

BREAKDOWN VOLTAGE

ASTM D149

kv/mm

4

FLAMMABLITY

UL-94


V-0

THERMAL CONDUCTIVITY

ASTM D5470

w/(m•k)

2.4


Fiber glass reinforced


Test Item

Unit

Data

Test Method


Color

-----

gray\pink

Visual


Reinforcement Carrier


fiber glass



Thickness

mm

0.23\0.3\0.45mm±0.05

ASTM

D374

Spec

mm

300mm×50M

ASTM

D1204

Density

g/cc

1.7±0.1

ASTM

D792

Hardness

Shore 00

75±5

ASTM

D2240

Tensile Strength

kg/cm2

>180

ASTM

D412

pa

1.8*1011

ASTM

D412


Breakdown Voltage

Kv/mm

≥4.0

ASTM

D149

Volume Impedance

Ω.cm

1.7×1013

ASTM

D257

Continuous Use Temp

-40~220

EN344


Thermal Resistance

/ W

0.25

ASTM

D5740

Flame Rating

------

V-0

UL

94

Thermal Conductivity

W/m.k

1.0

ASTM

E 1461-01


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